INSUFFICIENT WETTING(PAD)
INSUFFICIENT WETTING(PAD)
These two joints both show signs of insufficient wetting of the solder pad. The solder has wetted the leads nicely, but it has not formed a good bond with the pad. This can be caused by a dirty circuit board, or by failing to apply heat to the pad as well as the pin.
INSIFFICIENT WET PAD!!!!
REPAIR:
This condition can usually be repaired by placing the tip of the hot iron at the base of the joint until the solder flows to cover the pad.
PREVENTION:
Cleaning the board and even heating of both the pad and the pin will prevent this problem.
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